Tightly-coupled near-field communication-link connector-replacement chips

ABSTRACT

Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.

RELATED APPLICATIONS

This non-provisional application claims the benefit of ProvisionalApplication No. 61/203,702, filed on 23 Dec. 2008, and entitled“Tightly-Coupled Near-Field Radio Connector-Replacement Chips”, theentirety of which is hereby incorporated by reference.

FIELD OF THE INVENTION

The present invention relates generally to signal communication paths inelectronic systems, and relates more particularly to methods andapparatus for coupling signals between physically discontinuousconduction paths through near-field communication link circuits.

BACKGROUND

Advances in semiconductor manufacturing and circuit design technologieshave enabled the development and production of integrated circuits withincreasingly higher operational frequencies. In turn, electronicproducts and systems incorporating such integrated circuits are able toprovide much greater functionality than previous generations ofproducts. This additional functionality has generally included theprocessing of larger and larger amounts of data at higher and higherspeeds.

Many electronic systems include two or more printed circuit boards, orsimilar substrates, upon which the aforementioned high-speed integratedcircuits are mounted, and on and through which various signals arerouted to and from these integrated circuits. In electronic systems withat least two boards, and the need to communicate information betweenthose boards, a variety of connector and backplane architectures havebeen developed in order that information can flow between those boards.Unfortunately, such connector and backplane architectures introduce avariety of impedance discontinuities into the signal path which resultin a degradation of signal quality, also referred to as signalintegrity. Connecting two boards by conventional means, such assignal-carrying mechanical connectors generally creates two,closely-spaced discontinuities, and this complex discontinuity requiresexpensive electronics to negotiate.

Degradation of signal integrity limits the ability of electronic systemsto transfer data at very high rates which in turn limits the utility ofsuch products.

What is needed are methods and apparatus for coupling discontiguousportions of very high data rate signal paths without the cost and powerconsumption associated with physical connectors and equalizationcircuits.

SUMMARY OF THE INVENTION

Briefly, tightly-coupled near-field transmitter/receiver pairs aredeployed such that the transmitter is disposed at a terminal portion ofa first conduction path, the receiver is disposed at a terminal portionof a second conduction path, the transmitter and receiver are disposedin close proximity to each other, and the first conduction path and thesecond conduction path are discontiguous with respect to each other.

In some embodiments of the present invention, close proximity refers tothe transmitter antenna and the receiver antenna being spaced apart by adistance such that, at wavelengths of the transmitter carrier frequency,near-field coupling is obtained.

In some embodiments, the transmitter and receiver are disposed onseparate substrates, or carriers, that are positioned relative to eachother such that, in operation, the antennas of the transmitter/receiverpair are separated by a distance such that, at wavelengths of thetransmitter carrier frequency, near-field coupling is obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a high-level schematic representation of a signal path betweentwo integrated circuits, each of the two integrated circuits disposed ona different board, and wherein the signal path includes backplanetransceivers, a backplane, and a pair of physical connectors carryingthe signals to and from the backplane.

FIG. 2 is a high-level schematic representation similar to FIG. 1, butadditional shows various discontinuities in the signal path.

FIG. 3 is a high-level schematic representation of some of thecomponents of a signal path between two integrated circuits, each of thetwo integrated circuits disposed on a different board, and further showsdiscontinuities and terminations to reduce or eliminate the loss ofsignal integrity that would otherwise result.

FIG. 4 is a block diagram of a near-field transmitter/receiver pair, andindicating a separation of less than one centimeter.

FIG. 5 is a high-level representation of a line card and a backplanewherein signal paths are provided between physically separate wiresegments through the use of tightly linked near-field signaltransmission/reception.

FIG. 6 is a high-level representation of two signal paths, the firstsignal path including a first chip coupled to a first backplanetransceiver, which is coupled to a first signal-carrying mechanicalconnector, which is coupled to a backplane, which is coupled to a secondsignal-carrying mechanical connector, which is coupled to a secondbackplane transceiver, which is coupled to a second chip; and the secondsignal path, in accordance with the present invention, including a firstchip coupled to the backplane by means of a first near-fieldtransmitter/receiver pair, and the backplane coupled to a second chip bymeans of a second near-field transmitter/receiver pair.

FIG. 7 is a block diagram of an illustrative near-fieldcommunication-link connector-replacement chip in accordance with thepresent invention showing the major functional blocks of a transceiver.

FIG. 8 is a bottom view representation of an illustrative near-fieldcommunication-link connector-replacement chip in accordance with thepresent invention showing power terminals, signal terminals, and antennaplacement.

FIG. 9 is an enlarged side view of a portion of a pair of boardsdisposed perpendicularly to each other and further showing a near-fieldtransmitter/receiver pair positioned within a 2 to 5 millimeter range ofeach other.

FIG. 10 illustrates a near-field transceiver chip mounted to a substratewith an antenna disposed on the substrate adjacent to the chip.

FIG. 11 is a top view of a printed circuit board with a plurality ofnear-field transceivers disposed along one edge of the board.

FIG. 12 is a high-level block diagram of the transmit path of anear-field transmitter in accordance with the present invention.

FIG. 13 is a high-level block diagram of the receive path of anear-field receiver in accordance with the present invention.

FIG. 14 is a diagram illustrating the relationship between bandwidth andspectrum before and after converting the information to a modulatedcarrier at a higher frequency.

DETAILED DESCRIPTION

Generally, embodiments of the present invention provide methods andapparatus for transferring data through a physically discontiguoussignal conduction path without the physical size and signal degradationintroduced by a signal-carrying mechanical connector, and without theassociated costs and power consumption of equalization circuits. Variousembodiments of the present invention provide data transfer betweenphysically discontiguous portions of a signal conduction path by meansof near-field coupling apparatus which have tightly-linked transmitterand receiver pairs. These transmitters and receivers are typicallyimplemented as integrated circuits. Antennas for these may be internalor external with respect to the integrated circuits.

In some embodiments of the present invention, the transmitter/receiverpair includes a first chip with a transmitter and a second chip with areceiver; while in other embodiments the transmitter/receiver pairincludes a first chip with one or more transceivers, and a second chipwith one or more transceivers.

In some embodiments, the signal conduction path is single-ended, whereasin other embodiments the signal conduction path includes a differentialpair.

Conventional electronic connectors have an irregular frequency responsethat degrades signal integrity. Various embodiments of the presentinvention use a modulated carrier to confer immunity to impediments inthe frequency response of such connectors. In effect, the broadbandnature of an original signal is converted to a narrowband signal shiftedup to the carrier rate (see FIG. 14). It is noted that using a modulatedcarrier to transmit the original signal is still compatible with theoriginal electronic connector, presuming the connector is capable ofpassing the narrow-band carrier.

Since embodiments of the present invention use a modulated carrier totransport the original signal, it is desirable to use a very highfrequency carrier (EHF for example, which is 30 GHz to 300 GHz) to allowvery high data rates to be supported. As a consequence of using an EHFcarrier, transmission methods similar to radio are practical, and thehigher that the carrier frequency is, the smaller the physicaldimensions of embodiments of the invention can be. Most physicalconnectors are sized from between a few millimeters to a fewcentimeters, which roughly correspond to the wavelengths of EHF. Workingwithin the footprint of a given physical connector, it is possible tocreate coupling structures, or antennas, in accordance with the presentinvention, to eliminate the need for wires to physically contact eachother.

It is noted that the short wavelength of EHF signals (1 mm to 1 cm)allows tight coupling between each end of a near-fieldcommunication-link in accordance with the present invention. In turn,this allows multiple near-field communication-link connector-replacementchips to be closely spaced to each other while maintaining adequatechannel separation.

Reference herein to “one embodiment”, “an embodiment”, or similarformulations, means that a particular feature, structure, operation, orcharacteristic described in connection with the embodiment, is includedin at least one embodiment of the present invention. Thus, theappearances of such phrases or formulations herein are not necessarilyall referring to the same embodiment. Furthermore, various particularfeatures, structures, operations, or characteristics may be combined inany suitable manner in one or more embodiments.

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present invention. Itwill be apparent to those skilled in the art that the present inventionmay be practiced without these specific details. In other instances,well-known steps or components, are not described in detail in order tonot obscure the present invention. Furthermore, it is understood thatthe various embodiments shown in the figures are illustrativerepresentations and are not necessarily drawn to scale.

Terminology

Near-field communication link refers to an arrangement between atransmitting and a receiving antenna, where the distance between therespective antennas is roughly less than 2D²/lambda where D is thelargest dimension of the source of the radiation, and lambda is thewavelength.

The acronym EHF stands for Extremely High Frequency, and refers to aportion of the electromagnetic spectrum in the range of 30 GHz to 300GHz.

As used herein, the term transceiver refers to an integrated circuitincluding a transmitter and a receiver so that that integrated circuitmay be used to both transmit and receive information. In variousimplementations a transceiver is operable in a half-duplex mode, afull-duplex mode, or both.

The expression connector-replacement chips refers to embodiments of thepresent invention that fit within a form factor that would otherwise berequired to be occupied by a mechanical connector.

The terms, chip, die, integrated circuit, semiconductor device, andmicroelectronic device, are often used interchangeably in this field.The present invention is applicable to all the above as they aregenerally understood in the field.

With respect to chips, various signals may be coupled between them andother circuit elements via physical, electrically conductiveconnections. Such a point of connection is may be referred to as aninput, output, input/output (I/O), terminal, line, pin, pad, port,interface, or similar variants and combinations.

To obtain the full benefit of the very high speed integrated circuitsincorporated into electronic systems now and in the future, it isimportant to be able to communicate large amounts of information at highspeed between boards and/or over backplanes. Data rates of 10 Gbps orgreater are needed for upgrading the performance and capacity of variouselectronic systems. FIG. 1 illustrates a signal path between twointegrated circuits that includes discontiguous wire segments, backplanetransceivers, and connectors. More particularly, FIG. 1 shows a firstline card 101 having a first integrated circuit 102 and a firstbackplane transceiver 104 (the output driving function is represented),with a conductive path 113 disposed between first integrated circuit 102and first backplane transceiver 104, and another conductive path 115disposed between first backplane transceiver 104 and an edge of firstline card 101. A first signal-carrying mechanical connector 106 couplesthe output signal path of first backplane transceiver 104 from firstline card 101 to a conductive path 107 disposed on a backplane 103. Asignal-carrying mechanical connector 108 couples the conductive path 107of backplane 103 to a corresponding conductive path 109 on a second linecard 105, this corresponding conductive path 109 being connected to asecond backplane transceiver 110 (the receiver function is represented).The output of second backplane transceiver 110 is coupled to a secondintegrated circuit 112 via a conductive path 111 disposed therebetween.

Unfortunately, conventionally used physical means of couplingdiscontiguous conduction paths between boards, either directly betweenboards, or between boards with a backplane disposed therebetween,introduce signal degrading discontinuities. Impedance discontinuitiesare created by physical transitions in the signal path. Those skilled inthis field will appreciate that discontinuities may degrade signalintegrity more than wire length. Backplane signal paths may commonlyinclude a plurality of discontinuities.

Referring to FIG. 2, capacitive discontinuities, which may be created byvias between a buried stripline and a surface-mount component, areillustrated. Backplane connectors, such as signal-carrying mechanicalconnectors 106, 108, may also introduce discontinuities. Somediscontinuities may be tolerable in a design if they are disposed withina certain distance of a termination. Typically, discontinuities that arepaired in close proximity, and/or spaced away from a termination areproblematic with regard to signal integrity. FIG. 2 generallyillustrates the transitions that lead to discontinuities, and inparticular shows locations of capacitive discontinuities 202, 204 and206, 208 which result from transitions located away from properterminations. These transitions are caused by the use of signal-carryingmechanical connectors.

Conventional attempts to overcome these signal degrading discontinuitieshave included the introduction of complex backplane transceivers.Unfortunately such backplane transceivers add both cost and powerconsumption to the electronic products into which they are incorporated.In those instances where many physical transitions occur between thechips that need to communicate with each other, the engineering cost todevelop, implement, and deploy backplane transceivers suitable for aparticular application may also be very costly.

Recognizing that two closely-spaced discontinuities are bad for signalintegrity, one approach to improving signal integrity is to providetermination, for example the resistors 302, 304, 306, 308, at the edgesof line card 101, backplane 103, and line card 105 as shown in FIG. 3,and then regenerate the signal on major discontinuities. However,terminating and then regenerating the signal across a physical connectoris a problem due to the physical constraints of the mechanical systemthat houses the electronic connection between the respective conductionpaths.

Various embodiments of the present invention overcome the problem ofterminating and then regenerating the signal across a physical connectorby providing a method to eliminate the direct physical contact betweenthe respective conduction paths using a near-field communication-linksignal propagation path to couple the signal of interest between boardsand/or between a board and a backplane. Recent developments insemiconductor processing and device architecture allow integratedcircuits to operate at frequencies needed to implement a near-fieldtransceiver on a CMOS chip.

FIG. 4 provides a high-level schematic representation of a near-fieldtransmitter/receiver pair. In the illustrative embodiment of FIG. 4,transmitter 402 and receiver 404 are not physically touching, but arespaced in proximity to each other such that near-field coupling betweenthem is obtained. In accordance with the present invention, thenear-field transmitter/receiver pair provides an ultra-miniaturizedhigh-capacity communications link. An EHF carrier enables tiny antennasand very large bandwidth capacity. Additionally, signal equalization andtermination management may be integrated on the same chip with thenear-field transmitter, receiver, and/or transceiver.

FIG. 5 provides a high-level representation of a portion of anelectronic system including line card 101 and backplane 103 whereinsignal paths are provided between physically separate wire segmentsthrough the use of tightly-linked near-field signal coupling rather thansignal-carrying mechanical connectors. The near-field transceivers(transmitter section 402, receiver section 404) are disposed in theareas of the boards that conventionally would have been occupied bysignal-carrying mechanical connectors. No changes are required to theoverall mechanical structure of the system. In the illustrativeembodiment of FIG. 5, it can be seen that the transmit and receive chipsbecome adjacent once the card is inserted, i.e., the line card and thebackplane are brought into close proximity. Actual contact is notrequired between either the line card and backplane, or between thetransmit and receive chips. It is noted that the coupling field issufficient to allow 0° and 90° orientations. In the illustrativeembodiment of FIG. 5, chips 402, 404 on line card 101 are shown disposedsuch that one edge of each of them is adjacent an edge of line card 101.Similarly, chips 404, 402 on backplane 103 are shown disposed such thatthey reside inwardly from each edge of backplane 103. It will beappreciated that, in accordance with the present invention, noparticular location on a substrate is required for these chips otherthan that when the substrates are brought into the desired range ofalignment, the near-field transmitter/receiver pairs will achievenear-field coupling.

FIG. 6 is a high-level schematic representation of two signal paths 602,603 in a system 600, a first signal path 602, in accordance withconventional design practices, including a first chip 604 coupled to afirst backplane transceiver 606, which is coupled to a firstsignal-carrying mechanical connector 608, which is coupled to abackplane 610, which is coupled to a second signal-carrying mechanicalconnector 612, which is coupled to a second backplane transceiver 614,which is coupled to a second chip 616; and a second signal path 603, inaccordance with the present invention, including a first chip 620coupled to a backplane 626 by means of a first near-fieldtransmitter/receiver pair 624, and backplane 626 coupled to a secondchip 632 by means of a second near-field transmitter/receiver pair 628.Conventional signal path 602 further includes discontinuities 607 and609 associated with connector 608, and discontinuities 611 and 613associated with connector 612.

The arrangement of signal path 603, in accordance with the presentinvention, provides improved performance and reliability as compared toconventional signal path 602. The presence of signal-carrying mechanicalconnectors, and the associated signal path discontinuities inconventional signal path 602 introduce signal integrity problems as datarates increase (e.g., above 2 Gb/s). It can be seen, that signal path603, in accordance with the present invention, eliminatessignal-carrying mechanical connectors 608, 612 and backplanetransceivers 606, 614 of conventional signal path 602. The use ofnear-field transmitter/receiver pairs 624, 628 eliminates thesignal-carrying mechanical connectors. It can also be seen that thediscontinuities associated with connectors 608, 612, and thus the datarate limitations imposed by degradation of signal integrity, areadvantageously absent from signal path 603. Additionally, elimination ofsignal-carrying mechanical connectors from the signal path providesgreater reliability in mechanically harsh environments. Further, some orall of the circuitry found in the backplane transceivers 606, 614 may beeliminated in embodiments of the present invention because suchcircuitry was used to overcome the loss of signal integrity caused bythe signal-carrying mechanical connectors.

FIGS. 7-9 show some of the details of the near-fieldtransmitter/receiver pairs of the present invention. More particularly,FIG. 7 shows a block diagram of an illustrative near-field transceiverconnector-replacement chip in accordance with the present inventionillustrating the major functional blocks of a transceiver, including anantenna, an EHF oscillator, a modulator, a demodulator, atransmit/receive switch and amplifiers for the transmit and receivepathways. In this embodiment, four independent transceivers areincorporated into a single chip. It is noted that additional circuitrymay be incorporated into such near-field transceiverconnector-replacement chips so as to implement other functions desiredfor any particular implementation, such as aggregation of lower ratesignals into a single high-rate carrier. FIG. 8 shows a bottom view ofan illustrative near-field communication-link connector-replacement chipin packaged form, in accordance with the present invention, showingpower terminals, signal terminals, and antenna placement. Those skilledin the art and having the benefit of the present disclosure willappreciate that other arrangements of signal and power terminals arepossible within the scope of the present invention. FIG. 9 shows anenlarged side view of a portion of a pair of boards 902, 906 disposedperpendicularly to each other and further showing a near-fieldtransmitter/receiver pair comprised of a pair of near-field transceiverconnector-replacement chips 904, 908, positioned within a 2 to 5millimeter range of each other. In this illustrative embodiment, oneboard is a line card and the other is a backplane. Any suitable means ofdisposing the line card and the backplane such the near-fieldtransmitter/receiver pair are positioned to operate in a tightly coupledmanner may be used. In one example, a card cage, or rack, are used tothe slide the line card into an aligned position with the backplane.

Still referring to FIG. 9, various features and benefits of thetightly-coupled near-field transceiver connector-replacement chips canbe seen. For example, mechanical registration requirements are relaxedwith embodiments of the present invention, thus providing substantiallylooser manufacturing tolerances, leading in turn to lower cost andsubstantially vibration-proof connections. As compared to conventionalsignal-carrying mechanical connectors, where a few microns of separationwill open the connection, embodiments of the present invention can bepositioned plus or minus a few millimeters and still work. Zeroinsertion force is required as between a line card and a backplanebecause no mechanical contact is required between the two, eitherdirectly or by way of a mechanical connector. Since there is no contact,as is required with conventional approaches, there is no wear and tear,and thus essentially infinite cycling leading again to lower costs.Embodiments of the present invention are compatible with knownmanufacturing procedures, and actually eliminate a generally complicatedand expensive connector assembly step. Additionally, since signalequalization circuitry may be incorporated with the near-fieldtransmitters, receivers, and/or transceivers of the present invention,the system costs for peripheral silicon dedicated to backplane signalequalization can be reduced.

FIG. 10 shows a portion of an illustrative embodiment of the presentinvention that includes a near-field transceiver chip 1002 mounted to asubstrate 1004 with a coupling element 1006 (hereinafter referred to asan “antenna”) disposed on substrate 1004 adjacent to near-fieldtransceiver chip 1002. It is noted that coupling element, or antenna,1006 may have different shapes in different embodiments. In typicalembodiments, an edge portion of the integrated circuit die on which thetransceiver is formed is reserved for the antenna interface. In someembodiments, an antenna is disposed on the die, while in otherembodiments the antenna is disposed external to the die. In embodimentswith an external antenna, the antenna may be directly or indirectlycoupled to the circuitry of the die. Those skilled in the art and havingthe benefit of this disclosure, will appreciate that the shape of thecoupling element on the substrate may vary within the scope of thepresent invention.

FIG. 11 shows a printed circuit board 1102 with a plurality ofnear-field transceiver chips 1104 disposed along one edge of board 1102,and various other active and passive components commonly found onprinted circuit boards but not relevant to the present invention. Inthis illustrative embodiment, near-field transceiver chips 1104 aredisposed about 1 to 2 millimeters from the board edge, and have aseparation from each other suitable to prevent crosstalk betweenthemselves. It is noted that this arrangement occupies the same or lessvolume than an edge connector.

The near-field transmitter/receiver and method of the present inventionprovides advantages not found in conventional radio systems. In thisnear-field region, signal strength can be used to aid in selectivity,and large improvement in signal to noise ratios are possible. Near-fieldattenuation can be used to associate by proximity, so near-fieldtransceiver chips in accordance with the present invention can re-usefrequencies every few wavelengths of separation. In other words, even ifmultiple near-field transmitters in accordance with the presentinvention are disposed on the same or adjacent substrates, as long asthese near-field transmitters are spaced apart by several wavelengths ofthe transmitter signal, then the frequency of the transmitter signalscan be the same without interfering with each other. This is because, inaccordance with the present invention, the proximity of the transmitterand the receiver must be within the range in which near-field couplingbetween the transmitter and the receiver will occur.

FIG. 12 shows a high-level block diagram of the transmit path of anear-field transmitter in accordance with the present invention. Moreparticularly, an equalizer receives an input signal and compensates forstrip-line loss; an EHF carrier generator, either free-running or lockedto a reference extracted from the data input, is coupled to a modulator;and an antenna interface is coupled to the modulator, the antennainterface typically including an impedance matching network and a finaloutput driver coupled to an antenna.

FIG. 13 shows a high-level block diagram of the receive path of anear-field receiver in accordance with the present invention. Moreparticularly, an antenna is coupled to a receiver that has sufficientsensitivity and signal-to-noise ratio to maintain an acceptablebit-error-rate; the receiver is coupled to an EHF local oscillator andto a demodulator. The demodulator is coupled to a line-driver thatprovides equalization appropriate for the desired data rate.

Embodiments of the present invention using tightly-coupled near-fieldcommunication-link connector-replacement chips are differentiated fromtypical embodiments of contactless connectors as that term is commonlyunderstood. Contactless connectors are generally adaptations ofcapacitors or inductors that still require precise mechanicalpositioning, and use frequency reactive elements that create anon-uniform frequency response. On the other hand, embodiments of thepresent invention use a modulation scheme to immunize against parasiticeffects and resonances. Various embodiments of the present inventioninclude, but are not limited to, electronic products, electronicsystems, and connector-replacement means.

One illustrative embodiment in accordance with the present inventionincludes a first substrate with a first conduction path disposedthereon; a second substrate with a second conduction path disposedthereon; a first near-field transmitter connected to the firstconduction path; and a first near-field receiver connected to the secondconduction path; wherein the first substrate and the second substrateare spaced apart relative to each other such that the transmitter andreceiver are disposed within a distance from each other such thatnear-field coupling between the first near-field transmitter and thefirst near-field receiver at the transmitter carrier frequency isobtained. In another aspect of this illustrative embodiment, thetransmitter carrier frequency is in the EHF range. In another aspect ofthis illustrative embodiment, the first near-field transmitter isformed, at least partially, in a first integrated circuit; and the firstnear-field receiver is formed, at least partially, in a secondintegrated circuit. In some embodiments, the first near-fieldtransmitter includes an antenna disposed within the first integratedcircuit. In other embodiments, the first near-field transmitter includesan antenna disposed on the first substrate and coupled to the firstintegrated circuit. In some embodiments, the first substrate and thesecond substrate are spaced apart relative to each other such that thefirst near-field transmitter and the first near-field receiver aredisposed within a near-field coupling distance of each other at thefirst transmitter carrier frequency, the first transmitter carrierfrequency is in the EHF range, the first near-field transmitter isoperable to translate a data signal from the first conduction path to amodulated carrier and the first near-field receiver is operable totranslate the modulated carrier to a baseband signal on the secondconduction path.

An illustrative embodiment includes a first printed circuit board with afirst wire segment disposed thereon; a second printed circuit board witha second wire segment disposed thereon; a first near-field transceivermounted on the first printed circuit board such that it is spacedinwardly of a first peripheral edge thereof by a first predeterminedamount and in electrical contact with at least the first wire segment; asecond near-field transceiver mounted on the second printed circuitboard such that it is spaced inwardly of a first peripheral edge thereofby a second predetermined amount and in electrical contact with at leastthe second wire segment; wherein the first printed circuit board ispositioned with respect to the second printed circuit board such thatthe first peripheral edge of the first printed circuit board is spacedin close proximity to the first peripheral edge of the second printedcircuit board. In one aspect of this embodiment, the first transceiverand the second transceiver are disposed within a distance of each othersuch that, at wavelengths of the EHF carrier frequency, near-fieldcoupling is obtained. It will be appreciated that in alternativeembodiments, any substrate suitable for mounting a near-fieldtransmitter, receiver, or transceiver (near-field devices) may be used.Examples of suitable substrates for mounting and operation of theaforementioned near-field devices include, but are note limited to,flexible substrates, rigid substrates, multi-layer substrates, ceramicsubstrates, FR4, and cable ends. It will be further appreciated that thelocation on a substrate where a near-field device is mounted is notlimited to the peripheral regions of a substrate (e.g., an edge of aprinted circuit board), as long as the spacing requirements fornear-field operation between a transmitter/receiver pair are met. Insome embodiments, one or more of the near-field devices may be embeddedin a material such as, but not limited to, molded plastic packaging, ofeven embedded within a substrate material. data aggregation andserializer circuitry coupled to the first near-field transceiver, andde-serializer circuitry coupled to the second near-field transmitter

Another illustrative embodiment includes a line card with a first wiresegment disposed thereon; a backplane with a second wire segmentdisposed thereon; a first near-field transceiver mounted on the linecard such that it is spaced inwardly of a first peripheral edge thereofby a first predetermined amount; and a second near-field transceivermounted on the backplane; wherein the line card is positioned withrespect to the backplane such that the first peripheral edge of the linecard is spaced in close proximity to the second transceiver. In oneaspect of this embodiment, the first transceiver and the secondtransceiver are disposed within a distance of each other such that, atwavelengths of the EHF carrier frequency, near-field coupling isobtained.

It will be appreciated that various embodiments may include a pluralityof discontiguous signal paths and that these discontiguous signal pathsmay be coupled by a corresponding plurality of near-fieldtransmitter/receiver pairs, each pair disposed within a distance of eachother such that, at wavelengths of the EHF carrier frequency, near-fieldcoupling is obtained.

It is noted that the above-mentioned near-field transmitter, receivers,and transceivers, used as connector-replacement chips, may each beimplemented as an integrated circuit. It is further noted thatadditional circuitry may be incorporated into such near-fieldtransceiver connector-replacement chips so as to implement otherfunctions desired for any particular implementation, including, but notlimited to aggregation of lower rate signals into a single high-ratecarrier. In such an embodiment two or more different signal paths arecoupled to input terminals of a chip having at least a near-fieldtransmitter function, and the information from these two or moredifferent signal paths are combined to produce a single outgoingmodulated carrier from which the information of the two or moredifferent signal paths may be obtained. Similarly, a chip having atleast the near-field receiver function, receives the modulated signal,demodulates and obtains the information of the two different signalpaths and couples those two data streams to different output terminalsthereof. Data aggregation and serializer circuitry are coupled to afirst one of a pair of near-field transceivers, and de-serializercircuitry is coupled to the second one of a pair of near-fieldtransceivers.

In some alternative embodiments, the transmitter and receiver aredisposed on the same substrate such that, in operation, the antennas ofthe transmitter/receiver pair are separated by a distance such that, atwavelengths of the transmitter carrier frequency, near-field coupling isobtained.

In some alternative embodiments, a near-field transmitter may bemounted, or connected, to a wire, without the need for a substrate.Similarly, a near-field receiver may be mounted, or connected, to awire, without the need for a substrate. It is noted that in forming anear-field transmitter/receiver pair, either one or both of thenear-field transmitter and receiver may be mounted to a wire. In someembodiments, the near-field devices (i.e., transmitters, receivers,and/or transceivers) are mounted, or connected, to an end portion of thewire. It will be appreciated that such near-field devices may bemounted, or connected, to a flexible substrate.

CONCLUSION

The exemplary methods and apparatus illustrated and described hereinfind application in at least the field of electronic systems.

It is to be understood that the present invention is not limited to theembodiments described above, but encompasses any and all embodimentswithin the scope of the subjoined Claims and their equivalents.

What is claimed is:
 1. An electronic product, comprising: a firstsubstrate with a first conduction path disposed thereon; a secondsubstrate with a second conduction path disposed thereon; a firstnear-field transmitter disposed on the first substrate and connected tothe first conduction path, the first near-field transmitter operable totransmit a first carrier signal at a first transmit carrier frequency;and a first near-field receiver disposed on the second substrate andconnected to the second conduction path, the first near-field receiveroperable to near-field couple with the first near-field transmitter atthe first transmit carrier frequency; wherein the first substrate andthe second substrate are spaced apart relative to each other such thatthe first near-field transmitter and the first near-field receiver aredisposed within a near-field coupling distance of each other at thefirst transmitter carrier frequency, wherein the first transmittercarrier frequency is in the extremely high frequency (EHF) range,wherein the first near-field transmitter is operable to translate a datasignal from the first conduction path to a modulated carrier and thefirst near-field receiver is operable to translate the modulated carrierto a baseband signal on the second conduction path; and wherein thefirst conduction path comprises at least one pair of conductorsconfigured to communicate at least one differential signal.
 2. Theelectronic product of claim 1, wherein the first near-field transmitteris formed, at least partially, in a first integrated circuit; and thefirst near-field receiver is formed, at least partially, in a secondintegrated circuit.
 3. The electronic product of claim 1, wherein thefirst near-field transmitter includes an antenna disposed within thefirst integrated circuit.
 4. The electronic product of claim 1, whereinthe first near-field transmitter includes an antenna disposed on thefirst substrate and coupled to the first integrated circuit.
 5. Anelectronic product, comprising: a first substrate with a firstconduction path disposed thereon; a second substrate with a secondconduction path disposed thereon; a first near-field transmitterdisposed on the first substrate and connected to the first conductionpath, the first near-field transmitter operable to transmit a firstcarrier signal at a first transmit carrier frequency; and a firstnear-field receiver disposed on the second substrate and connected tothe second conduction path, the first near-field receiver operable tonear-field couple with the first near-field transmitter at the firsttransmit carrier frequency; wherein the first substrate and the secondsubstrate are spaced apart relative to each other such that the firstnear-field transmitter and the first near-field receiver are disposedwithin a near-field coupling distance of each other at the firsttransmitter carrier frequency, wherein the first transmitter carrierfrequency is in the extremely high frequency (EHF) range, wherein thefirst near-field transmitter is operable to translate a data signal fromthe first conduction path to a modulated carrier and the firstnear-field receiver is operable to translate the modulated carrier to abaseband signal on the second conduction path; and wherein the secondconduction path comprises at least one pair of conductors configured tocommunicate at least one differential signal.
 6. The electronic productof claim 5, wherein the first near-field transmitter is formed, at leastpartially, in a first integrated circuit; and the first near-fieldreceiver is formed, at least partially, in a second integrated circuit.7. The electronic product of claim 5, wherein the first near-fieldtransmitter includes an antenna disposed within the first integratedcircuit.
 8. The electronic product of claim 5, wherein the firstnear-field transmitter includes an antenna disposed on the firstsubstrate and coupled to the first integrated circuit.
 9. A connectorreplacement, comprising: a first near-field transmitter, the firstnear-field transmitter operable to modulate a first carrier signal at afirst transmit carrier frequency in the extremely high frequency (EHF)range; and a first near-field receiver, the first near-field receiveroperable to near-field couple with the first near-field transmitter atthe first transmit carrier frequency; wherein the near-field couplingoccurs only if the first near-field transmitter and the first near-fieldreceiver are disposed within a distance from each other that is lessthan 2D²/lambda, where D is the largest dimension of the source of theradiation, and lambda is the wavelength of the first transmit carrierfrequency; and wherein the first near-field transmitter is part of afirst near-field transceiver on a first integrated circuit; the firstnear-field receiver is part of a second near-field transceiver on asecond integrated circuit; the first integrated circuit is adapted tocouple to a first differential signal path on a first substrate; and thesecond integrated circuit is adapted to couple to a second differentialsignal path on a second substrate.
 10. The connector replacement ofclaim 9, wherein the first near-field transmitter is disposed on a firstintegrated circuit.
 11. The connector replacement of claim 9, whereinthe first near-field receiver is disposed on a second integratedcircuit.
 12. The connector replacement of claim 9, wherein the firstnear-field transmitter is part of a first near-field transceiver on afirst integrated circuit.
 13. The connector replacement of claim 9,wherein the first near-field receiver is part of a second near-fieldtransceiver on a second integrated circuit.